发明名称 INTERNAL WIRING FOR SEMICONDUCTOR IC
摘要 PURPOSE:To prevent electromigration caused disconnection by a method wherein belts of conductive films of different resistance are piled upon one another and the belt with the lowest resistance is separated into several small parts by slits. CONSTITUTION:A P type duffused layer 2 is formed on an N type Si substrate 1. The layer 2 is covered with an oxide film 3 provided with a window for establishing contact with the diffused layer 3. Through the window, a TiW film 4 difficult to effect electromigration in spite of high layer resistance is sandwiched between an Al film 5 in the form of a belt including a bonding pad 6 apt to effect electromigration in spite of its low layer resistance and the oxide film 3. The Al film 5 is separated into several parts by slits 7. The slits 7 cause a current to flow through parts of higher resistance but there is but a little increase in resistance, and migration is prevented.
申请公布号 JPS57136346(A) 申请公布日期 1982.08.23
申请号 JP19810021972 申请日期 1981.02.17
申请人 NIPPON DENKI KK 发明人 FUTAGAWA KIYOSHI
分类号 H01L27/04;H01L21/04;H01L21/3205;H01L21/822;H01L23/52 主分类号 H01L27/04
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