| 摘要 |
PURPOSE:To form an excellent preparatory solder layer onto the metallic substrate of the die pad, etc. of a lead frame by moving an adsorbing needle in a scrubbing shape through a slide shaft when a preparatory solder material is placed onto the metallic substrate. CONSTITUTION:The adsorbing needle 4 adsorbs spherical solder by the falling of a cylinder 6 and a vacuum adsorbing device, the adsorbing needle 4 is lifted, and the adsorbing needle 4 reaches on the die pad of the lead frame 14 through the revolution of a cam 17. The adsorbing needle 4 is dropped onto the lead frame by the cylinder 6, a rotatory arm 13 is given minute rotation by grooves 17b formed to one part of the cam through the revolution of the cam 17, and the rotation moves the adsorbing needle 4 in the scrubbing shape. The spherical solder, the surface thereof is oxidized, is rubbed onto the contacting surface of the die pad of the lead frame 14 by the movement, the oxide film of the surface of the spherical solder is broken and new solder is exposed. |
