发明名称 FORMING METHOD FOR SYNTHETIC RESIN AND APPARATUS THEREFOR
摘要 PURPOSE:To perform forming process effeciently with less energy consumption by following method in which dies are kept apart from cooling plates in the heating stage and are kept in contact with cooling plates for cooling in the compression stage, when synthetic resin is formed by compression. CONSTITUTION:Dies 4 are connected to cooling plates 2 which are fixed to die plates 1 of a compression press. The dies 4 are kept apart from cooling plates 2 in the heating stage for the dies 4 by a push spring 6 fixed to the cooling plates 2. After the dies 4 are heated to a constant temperature by supplying heat medium from a heat medium port 5, a frame plate 9 is inserted and further synthetic resin blank 10 is inserted into the gap between the dies 4. Next, the pressurized die plates 1 compress synthetic resin blank 10 into a plate like formed product, and simultaneously, the dies 4 are coaled by contact with the cooling plates 2 and accordingly the plate like formed product in the dies is cooled and cured.
申请公布号 JPS57135137(A) 申请公布日期 1982.08.20
申请号 JP19810020863 申请日期 1981.02.17
申请人 ASAHI DOW KK 发明人 KATAOKA HIROSHI
分类号 B29C43/00;B29C33/00;B29C33/04;B29C35/16;B29C37/00;B29C43/02;B29C43/52;B29C45/00;B29C45/64;B29C45/73;B30B15/06 主分类号 B29C43/00
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