发明名称 METHOD OF EXPOSING SEMICONDUCTOR TO LIGHT
摘要 PURPOSE:To eliminate misalignment with a mask and to effect uniform exposure to light by a method wherein either one of a wafer or a mask is held flat but the other one is forced into arc shape to cause successive linear contact between both. In addition, exposure to light is limited only to the linear contacting zone. CONSTITUTION:The left-hand edge of a wafer m1 is in close contact with the left-hand edge of a mask n1 and the mask is held level. On the other hand, a lighting sleeve 18 is provided at a specified position over the contacting line P between the wafer and the mask to expose the left-hand edge of the wafer m1 at right angle with parallel rays 19 at the contacting line P. Then, the wafer chuck 15 is gradually swung toward the left and the mask is horizontally moved left synchronously with movement of the wafer so as to shift the contacting line P grandually. In this way, the parallel rays 19 allow the wafer to be exposed gradually from the left-hand edge m1 toward the right. Upon the right-hand edge of the wafer m2 being exposed, exposure of the wafer to the light is completed.
申请公布号 JPS57134931(A) 申请公布日期 1982.08.20
申请号 JP19810020281 申请日期 1981.02.13
申请人 SHIN NIPPON DENKI KK 发明人 HIDA KIYOBUMI
分类号 H01L21/027;G03F7/20;(IPC1-7):01L21/30 主分类号 H01L21/027
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