发明名称 INTEGRATED CIRCUIT CHIP CARRIER
摘要 Known chip carriers are usually made of ceramic material which is expensive and can give rise to problems due to differential expansion when bonded to conventional epoxy/glass printed circuit board. …<??>The invention provides a chip carrier comprising a base (10) of plastics material and a side wall (22) of plastics material, extending around the periphery of the chip carrier so as to define a chip mounting cavity. Conductive tracks extend from first connecting points (12) in the cavity to second connecting points (18) on the periphery of the chip carrier.
申请公布号 AU7970982(A) 申请公布日期 1982.08.19
申请号 AU19820079709 申请日期 1982.01.21
申请人 BRITISH TELECOMMUNICATIONS 发明人 FRANCIS NIHAL SINNADURAI;ANTHONY JAMES COOK;KEITH WILLIAM GURNETT
分类号 H01L23/14;H01L23/498 主分类号 H01L23/14
代理机构 代理人
主权项
地址