| 摘要 |
PURPOSE:To perform a perfect bonding work by a method wherein, when the bump of the IC chip is soldered at the end section of the lead which is provided on the film carrier, the solder is solidified while a thermode (electrode tip), to be pressed on these materials, is pressed for a fixed period of time in the state wherein the thermode is slightly raised relatively from the material to be joined together. CONSTITUTION:The lead 2, having an end protruding toward the opening of the film carrier 1, is faced downward, and the chip 3 is positioned under the lead 2 while contacting the bump 4 of the IC chip 3 to the end section of the lead. Then, the thermode 6, which is surrounded by a spring 11 attached to a spring mounting plate 10 and having a shaft passing through a mounting plate 10, is faced to the opening of the carrier 1, the thermode 6 is pushed down and the lead 2 is contacted to it, and the lead 2 and the bump 4 are adhered through the intermediary of a solder layer. In this constitution, the amount of deflection of the spring 11 is regulated using a cam and the like, the thermode 6 is relatively raised a little from the materials to be joined together, the materials to be joined together are pressed for a fixed period of time, and the fused solder is solidified in the above condition. |
