Solid-state image pickup element and process for fabricating the same

摘要

A highly sensitive and high-density picture element solid-state image pickup element and a process for fabricating the same which is featured in (a) that in the step for patterning a photoconductive layer, a protective pattern resisting an etchant is formed by using an ultraviolet-ray-setting resin which is also used in the step for bonding a color filter and then the undesired areas of the photoconductive layer, which has been formed over the whole surface of a wafer, are removed and (b) that the color filter having a stripe or mosaic pattern is bonded to the protective pattern with the same ultraviolet-ray-setting resin. Alternatively, after the color filter has been bonded, the undesired areas of the photoconductive layer are removed with the color filter used as an etching mask.