发明名称 SPHERE CUTTING DEVICE IN HALF
摘要 PURPOSE:To make it unnecessary to renew a holding conditions of a sphere during a cutting work in half by securing a sphere under pressure between two V blocks and cutting the sphere together with the V block fixed to a base. CONSTITUTION:A cutting grindstone wheel 5 is provided in a cutting device 4, and a transfer table 6 which is movable along a rail 7 in parallel with the grindstone wheel 5 is placed on the device 4. A sphere 21 is secured under pressure between a V block 9 fixed to the table 6 and a movable V block 10. The sphere 21 is cut by moving the transfer table 6 along the rail 7 toward the grindstone wheel 5. At first, the sphere 21 is cut together with the V block 9, but since the V block is fixed to the table 6, the sphere 21 can be secured without hindrance in the second time and later, and the grindstone wheel 5 cuts the sphere 21 passing through a partition groove 22 formed in the first time.
申请公布号 JPS57132959(A) 申请公布日期 1982.08.17
申请号 JP19810018683 申请日期 1981.02.10
申请人 AISHIN SEIKI KK 发明人 SHIROSHITA YOSHIHEI
分类号 B23D47/04;B24B27/06;(IPC1-7):24B27/06 主分类号 B23D47/04
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