| 摘要 |
PURPOSE:To conduct grinding, polishing, and washing of semiconductor wafers simultaneously at a high speed by transferring works in one pass through a multi-head grinding machine provided with plane grinding and polishing units, etc. CONSTITUTION:A vacuum chuck is provided on a rotary table 7 to hold works 4, 6, 8, 11, 15, 18, 19, 21. Works 4, fed from an automatic conveying unit 2 by an autoloading unit, are grinded 6 by a plane grinding unit, processed 8, 11 by the second and the third grinding shafts, jet washed 13, polished 15 by a polishing unit 14 at a high speed, washed 18 by a jet washing unit 16, dried 19 by air blows from a compressor 20, and stored in an automatic storing cassette 24. The vacuum chuck is cleaned by 23. |
