| 摘要 |
PURPOSE:To avoid deformation of wires to connect parts and to prevent also flash of resin when the upper part of a substrate equipped with the electronic parts is to be covered with a tablet type resin sealing material by a method wherein a barrier is provided at the circumference of the parts, the sealing material is put thereon, and the sealing material is made to be molten to be integrated in one body. CONSTITUTION:An electronic part 2 is fixed on the circuit substrate 1 provided with a circuit wiring pattern, and electrodes thereof are connected to the electrode parts formed on the surface of the substrate 1 using the wires 4. Then the tablet type resin sealing material 5 is arranged covering the part 2 and the wires 4, but at this time, the barrier 3 consisting of porcelain, ceramics, polycarbonate, Teflon, etc., having the triangular section is provided at the circumference of the part 2, and the sealing material 5 is arranged coming in contact with the inside circumference thereof. The device is constituted by this way, the wires 4 are heated to make the sealing material 5 to be molten from the part coming in contact with the barrier 3, and the sealing material 5 is made to drop gradually to cover the parts 2 and the wires 4. |
