| 摘要 |
PURPOSE:To prevent contamination on a copper plate surface which is to be an electrode surface by a method wherein a junction plane between an Al product and a copper plate is formed to be protruded outward and the copper plates are joined by butting so as to be extended at its extreme circumference more outward than the junction plane and anti-corrosion treatment such as painting or the like is applied in the vicinity of the junction. CONSTITUTION:For example heat radiating fins 1 consisting of Al plates are fixed by brazing to a spacer 2 made of Al, and at the end of the spacer 2 which is extended more outward than the most outward fin, copper plates 3 which have more larger diameters than that of the spacer 2 are jointed by brazing. On one of copper plates 3 a semiconductor element 4 or the like is attached and another copper plate 3 is used as an electrode terminal. After junction is performed painting and (or) resin coking are (is) applied on the vicinity (c) of junction planes. By this method because the vicinity of junction planes is formed to be a circular groove, contamination on an electrode surface (d) can hardly occur when brazing or corrosion protecting treatment is applied, and falling-off of painting or the like also can hardly occur. |
