| 摘要 |
PURPOSE:To prepare the titled multilayer wiring being excellent in adhesiveness of a connection part by providing a heating resistor and a multilayer wiring part monolithically on a substrate provided with a dielectric glazed layer. CONSTITUTION:A plurality of the first conductor layers 103 are formed on the substrate 101 provided with the dielectric glazed layer 102, an insulator layer 104 for multiwiring having the same number of openings with that of the heating resistor 109 is provided so as to cover the layer 102, and throughout the whole surfaces of the insulator layer 104, the part of the glazed layer 102 not covered with the former and the conductor layer 103 exposed in the opening of the insulator layer 104, the first thin metal layer 106 is provided. Next, after the second thin metal layer 107 is formed on the insulator layer 104, a conductor electrode 107 for connection is formed by subjecting the metal layer 107 to photoetching so as for the layer 107 to remain on the metal layer 106 in the opening part provided in the insulator layer 104, an etching resistant layer 105 is formed by oxidizing the metal layer 106, the multiwiring part is formed by connecting the conductor layer 103 with the electrode 107, and thereafter a plurality of heating resistors 109 are provided. |
