发明名称 MOLDS FOR FORMING RESIN SEAL FOR INSERT
摘要 PURPOSE:To raise the releasing property, moisture resistant reliability, etc., of molding by applying an aventurine finishing with a specific range of max. roughness to the surface of the cavity of molds for forming a resin seal for an insert. CONSTITUTION:An insert, e.g., a lead frame 11 bonded with a semiconductor pellet 10, is beforehand put in a cavity 8 formed by an upper mold 4 and a lower mold 5, and then molten resin 1 is charged into the cavity 8 to seal up the lead frame 11 with the resin. In this case, a smoothly but undulately surfaced aventurine face with a max. surface roughness (Hmax) of 5-15mum is provided to the surface of the cavity 8 in such a way that the differences in the center value and the upper limit value of the roughness become 2mum or less by the upper mold face and the lower mold face of the cavity 8. Thus, the difference in the separability between the upper mold and the lower mold is smaller and the delamination in the interface between the insert and the resin can be prevented.
申请公布号 JPS57129710(A) 申请公布日期 1982.08.11
申请号 JP19810015076 申请日期 1981.02.05
申请人 HITACHI SEISAKUSHO KK 发明人 TSUNODA SHIGEHARU;SAEKI JIYUNICHI;KANEDA AIZOU
分类号 B29C33/00;B29B7/00;B29B13/00;B29C33/38;B29C33/42;B29C33/44;B29C39/00;B29C39/10;B29C39/26;B29C45/00;B29C45/02;B29C45/37;B29K105/22;B29L31/34;H01L21/56 主分类号 B29C33/00
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