| 摘要 |
PURPOSE:To release and remove the residual stain of slder layer by suitable thermal treatment after a semiconductor element is fixed on a metallic supporter via the solder layer. CONSTITUTION:A semiconductor element 2 is fitted to the specified position of a semiconductor system 1 composed of a metallic supporter via a solder tablet. While the solder is melted by heating, the semiconductor element 2 is slid back and forth so as to be fixed in good cavity-free contact condition. Then the whole system is subjected to the thermal treatment by slow heating and cooling, for instance, at 270 deg.C-280 deg.C for 4-6hr. With this constitution, the deterioration of the semiconductor is avoided and the junction of the semiconductor has low thermal resistance and the strain of its solder layer is removed, so that an ideal junction can be obtained. |
