| 摘要 |
PURPOSE:To reduce the cost of the electronic part by utilizing inexpensive polyester film as a film. CONSTITUTION:An Si LSI chip 4, on which a solder bumb 3 that can be processed at a low temperature is formed, is bonded to a thin film wiring 2 (formed by solderable metal such as Cu, Fe, Ni, Au, and Pd) formed on the polyester film 1. Then, said LSI chip 4 is further coated by silicon resin 5, and left alone for a suitable period of time. After the resin is cured, the surface is covered by the polyester film 6. The peripheral part 7 of the film is thermally compressed so as to protect the LSI film chip 4. In this way, the LSI can be flip-bonded to the wiring on the polyester film which lacks the heat resisting property, and the inexpensive electronic parts can be obtained. |
