| 摘要 |
PURPOSE:To perform positioning of a substrate and measurement of flatness, by attaching a contacting ring to which the substrate is contacted to a supporting stand which can be freely moved up and down, in the concave part of a vacuum chuck table, and moving the position of the substrate up and down. CONSTITUTION:The semiconductor substrate 18 is plced on the contact ring 16 which is provided in the concave part of the vacuum chuck table 1, so that the peripheral side surface thereof is contacted with a positioning member 20. Then, the pressure of the inside of a vacuum chamber 2 is reduced by a c vacuum pump 4 through an exhausting port 5 and an intake port 12, and the semiconductor substrate 18 and the contacting ring are fixed to a specified position so as to form a unitary body. Thereafter, a lever 8a is turned to push up an elevating shaft 3, and the supporting stand 7 is elevated. The supporting stand 7, the contacting rings 6a and 16 and the semiconductor substrate 18 are incorporated in a unitary body. When they are pushed up to the position higher than the positioning member 12, they are stopped. Under the state no obstruction is found over the surface of the semiconductor substrate 18, a standard mirror body 22 is placed on the surface, with a specified interval being maintained, the flatness of the substrate 18 is measured. |
