| 摘要 |
<p>PURPOSE:To automatically and efficiently coat a solder by soldering a necessary part to be soldered while moving a semicoductr product along a soldering line. CONSTITUTION:A semiconductor product integrated on a produt supply unit 10 is supplied to the rails 26 of a product moving mechanism 20, is then fed to a flux coating unit 12, is coated with the flux on the external lead terminal, and is then fed to a soldering unit 14. The product is coated with the solder on the external lead terminal. Thereafter, the product is cooled by a cooling fan 34, and is then washed with cleaning water in a cleaning and drying unit 16 so that the flux residue is removed, and water droplets are scattered by a draining unit 24, and is dried with hot air by a drying unit 44. The semiconductor device thus completely dried is fed on the rails 26 to a product recovery unit 18, and is contained in a product containing magazine 46.</p> |
