| 摘要 |
A semiconductor wafer is provided with a plurality of semiconductor pellets arranged in rows and columns in a checkered pattern on its main opposite faces. A groove in the form of a closed loop is disposed around each pellet on one of the main faces and is spaced from grooves encircling the adjacent pellets to leave a grid between the pellets, and grooves are disposed on the other main face which simply separate the pellets. All the grooves are covered with glass passivation layers. The wafer is divided into the semiconductor pellets by dicing it along the central lines of the bars forming the grid. |
