| 摘要 |
An integrated circuit contains a substrate 1 with a conduction pattern 13, 18 and a semiconductor wafer, in which an electric circuit has been formed. The circuit's inputs and outputs consist of metallised contact surfaces 23, 28 on the surface of the wafer facing the substrate. A layer or a foil, fabric, or the like 40 of conducting material is arranged between the wafer and the substrate and extends across a plurality of contact surfaces. The layer, the contact surfaces, and the conduction pattern are formed so that the layer's conductivity between two opposite contact surfaces at the wafer and the conduction pattern is much larger than its conductivity in the lateral direction between adjacent contact surfaces. <IMAGE> |
