| 摘要 |
PURPOSE:To avoid the generation of strain at the time of the attaching of a radiating plate, and to prevent the generation of the trouble of the semiconductor device by mounting a semiconductor chip onto a stem surface at the same side as the surface to be worked of a flange to which press working is executed. CONSTITUTION:When the semiconductor chip 28 is mounted to a stem formed by attaching an inner lead 26 to the flange 22, the semiconductor chip 28 is mounted onto the stem surface at the same side as the surface to be worked of the flange 22 to which the press working is executed. The semiconductor chip 28 is mounted onto the stem surface at the reverse side to the direction that the fringe section of the flange is bent through the press working at that time. Accordingly, when the chip 28 and the lead 26 are connected and the chip 28 is sealed by a shell member 30, bending in the opposite direction to bending generated in a press process is formed in the flange, both are denied mutually, and the flange surface is flatly shaped. |
