发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
PURPOSE:To obtain a photosensitive PVA resin composition developable with water and having superior flexibility and impact resistance after photosetting by blending a PVA polymer with water soluble polyamide and a diazo compound or an azide compound. CONSTITUTION:A polyvinyl alcohol polymer (A) is blended with 0.5-100pts.wt. water soluble polyamide (B) to 100pts.wt. of the polymer and a diazo compound or an azide compound (C). When the polymn. degree of the used PVA polymer is excessively low, the resulting resin plate tends to reduce the surface hardness, so the preferred polymn. degree is >=100. The preferred water soluble polyamide is polyamide having sulfonic acid or sulfonate bonded to a benzene ring or a naphthalene ring. |
申请公布号 |
JPS57124729(A) |
申请公布日期 |
1982.08.03 |
申请号 |
JP19810011329 |
申请日期 |
1981.01.27 |
申请人 |
UNITIKA KK |
发明人 |
OKAMOTO TAKASHI;MITSUI MINORU;DOI OSAMU |
分类号 |
C08K5/28;C08L29/00;C08L29/04;C08L77/00;G03F7/032;G03F7/038 |
主分类号 |
C08K5/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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