| 摘要 |
PURPOSE:To form individual matrix wiring members having the same number as multi-layer wiring boards, by a method wherein in a heat-sensitive recording head including matrix wiring of a plurality of heaters, a wiring board is formed by lamination of a plurality of L-shaped resilient substances. CONSTITUTION:A multi-layer wiring board 13a comprising L-shaped resilient films for constituting multi-layer wiring portion is laminated on a substrate 14 and another multi-layer wiring board 13b is further laminated thereby multi- layer wiring boards haing a plurality of individual multi-layer wiring members are formed. Multi-layer wiring by film carriers 20 is formed between electrodes 22 on the two individual wiring boards 13a, 13b and an electrode 17b having a heater 16 on a substrate 12. Thus wiring of two individual matrices is formed as blocks having the same number as diodes in a diode chip by the two multi- layer wiring boards 13a, 13b, and arbitrary plural number of the matrix wiring members are made practicable by increasing the multi-layer wiring boards. |
