| 摘要 |
PURPOSE:To prevent the production of resist powder during the use of wafers in an optical mask used by a transfer method using light by making the circumference of the wafer bright or dark so as to prohibit remaining of resist in said part. CONSTITUTION:In an optical mask used by a transfer method using light such as projection transfer, contact transfer or the like, an effective chip area 5 smaller than a wafer area 9 and the outer side of said area 5 are made bright when positive type resist is used and dark when negative type resist is used so as to prohibit remaining of the photoresist in the part of the wafer manufactured by the above-described method in contact with a wafer carrier and therefore the photoresist in the part in contact with the wafer carrier in a conventional production process for wafers is eliminated; hence, the formation of the resist powder during use is prevented. |
