| 摘要 |
PURPOSE:To automate precisely the positioning step of a package in the steps of assembling, testing and sorting semiconductor devices by forming a through hole at a part of the package and receiving the light from a light source through the hole. CONSTITUTION:A positioning (direction determining) through hole 16 is formed in the vicinity of one corner of a package 10 which contains devices such as transistors, IC, etc. A light source 18 is provided above the hole 16, and a photodetector 20 for receiving the light of the light source 18 through the hole 16 is mounted below the hole. For example, this package 10 is placed and rotated on a turntable so as to be accurately disposed in the prescribed direction when the light is received. In this manner, the positioning step can be accurately and automatically performed in the steps of bonding, sealing, marking as assembling steps, testing the characteristics, sorting as working steps. |
