| 摘要 |
PURPOSE:To make an apparatus corresponding to the change in an array of through hole by inserting a guide plate properly selected to coincide with the array of through hole into a probe socket mounted to the apparatus when the through hole of a printed circuit board and the conduction of the circuit pattern thereof. CONSTITUTION:A guide plate 25 is fitted onto a plurality of supports 24 erected on the top of an inspection apparatus body 21 through a recess 26 and fixed. After a probe socket 28 is inserted into a socket insertion hole 27 of the guide plate 25, a wire 30 of phosphor-bronze is mounted at the lower end of a socket 28. At the upper part of the body 21, funnel-shaped contact pins 23 are buried in a latice in such a manner as to be movable vertically through receiving holes 22 and the lower end of the wire 30 is connected to an electronic controller of the body 21 in a good contact with the pins 23. Inspection pins 29 at the upper end of the sockets 28 are pressed in coincidence with the through holes 10 of a printed circuit board 11 and moved downward against a spring in the sockets 28 whereby the pins 29 are connected satisfactorily to the through holes 10. For substrates different in the array of the through hole, a proper guide plate 25 is selected. |
