| 摘要 |
<p>PURPOSE:To enhance the hermetical sealability of a glass sealing part by a method wherein Cu-plating is formed over the metallic piece electrode of a morph type diode or the like using sintered and shaped Fe-Ni alloy and a cuprous suboxide film is formed on the surface of the plating layer. CONSTITUTION:A Cu-Plating layer 2b of 1-20mum thick is covered by a barrel plating method on the surface of an iron-nickel alloy mandrel 2a formed by sintering and shaping. Then, a cuprous suboxide film 2c is then formed by heating with a burner or the like on the surface of the Cu-plating layer as a metallic piece electrode 2. Subsequently, a solder 1 is secured to the large-diameter part of a pair of electrodes 2, a pellet 3 is secured between the other ends, and is hermetically sealed with a glass layer 4. Thus, the electrode can be accurately produced without header machining, and since no crack nor exfolication occurs at the cuprous oxide film, thereby improving the hermetical sealability and preventing the production of the crack of the sealing glass.</p> |
