SILVER PLATING PROCESS, AND SOLUTION FOR USE THEREIN

摘要

An aqueous electrolyte solution for electrodepositing silver, comprising at least about 15 g/l of silver as alkali silver cyanide, 10 g/l of free cyanide or less, and a mercaptan compound in a sufficient amount to eliminate or effectively reduce immersion plating of the silver onto the substrate.
The invention also includes the treatment of the substrate with a mercaptan compound and electroplating silver thereover with a silver cyanide plating solution containing 10 g/l of free cyanide or less.