| 摘要 |
PURPOSE:To cover an intended coating part conpletely with molten solder of approximately uniform thickness and to obtain good adhesion by spreading the molten solder placed on the intended solder coating part with a bar formed of a material having poor affinity to solder. CONSTITUTION:A syringe holder with a discharger packed with soft solder 2 is pressed perpendicularly to an element mounting part 3 of a lead frame, and the solder 2 is discharged. Next, a bar 7 of a square clumn or the like made of a material repelling the solder 2 is pressed perpendicularly onto the solder 2 on the part to forcibly spread the solder 2. Then, the solder 2 in the part 3 covers the intended coating area completely with approximately uniform thickness. Thereafter, a silicon substrate 4 is pressed onto the spread solder 2 on the part 3, whereby it is adhered. |
