| 摘要 |
PURPOSE:To save the molding material for a resin-molded semiconductor device and to eliminate a strain of the device due to a thermal shock by providing a cavity in a case in which insulating molding resin is filled. CONSTITUTION:External leads 2, 3, 4, 5 connected to a semiconductor pellet are bent in L shape and are led externally of a case 6. The relationship between the case 6 and the lead 2 is such that the three sides of the lead 2 are surrounded by side walls 6j, 6k, 6l so that the distances between the respective side walls and the lead 2 are approximately equal to each other, and epoxy resin 8 is not filled in a cavity 10 thus produced. In this manner, not only the total quantity of the used epoxy resin 8 is reduced as compared with the conventional one, but the strain of the epoxy resin itself can be reduced, and the strain can be hardly produced due to the equal distance from the side walls. |
