| 摘要 |
PURPOSE:To improve the heat radiation of a semiconductor device and to improve the mounting density of the device by rigidly integrating a ceramic substrate which places a semiconductor element through a metallic solder layer to a metallic member containing mainly aluminum. CONSTITUTION:A lead-tin solder sheet 13 is placed on the flat surface 12 of an aluminum heat sink 11, is preheated, a supersonic vibrator 14 is contacted with the sheet 13 under pressure, and the sheet 13 is perliminarily thermally fusion- bonded. On the other hand, an alumina plate 16 soldered with pellets 15a, 15b on the regions 17a, 17b having metallized regions is placed on an aluminum heat sink 11, is heated in hydrogen stmosphere, and the heat sink 11 and the plate 16 are integrally thermally molten, and are molded thereon. |
