| 摘要 |
PURPOSE:To improve the yield in the manufacture of an integrated circuit device without increasing the area of the chip by disposing an output terminal on a semiconductor chip between a power wire made of metallic wire and a ground line made of metallic wire. CONSTITUTION:A power wire 31 and a ground wire 32 are disposed at both sides of an output terminal 35 with respect to the side 38 of a semiconductor chip, thereby enabling to eliminate a crossing section between the power wire 32 connected to the contacts 37a-37k of a diffused region 36 under load transistor gates 33a-33e and driver transistor gates 34a-34e connected to input signals 39a, 39b. Therefore, the power wire and the ground wire can be all made of metallic wires, therrby reducing the resistance of the wires. |
