| 摘要 |
PURPOSE:To enable the ready mounting of a semiconductor chip having high integration on an island by forming a laminate structure of an inner lead and a laminated inner lead, thereby preventing the shortcircuit due to the contact of a bonding wire. CONSTITUTION:The second substrate 4 is formed in space of the prescribed interval on the first substrate 3 formed with an island 1 mounted with a semiconductor element and an inner lead 2. The substrate 3 is formed in a flat plate with a window 3a. An island 1 of a square shape is held at both sides from two supporting rods la secured at one end to the periphery of the window 3a at the center, and many inner leads 2 are faced with the respective sides of the island 1 at the periphery of the window 3a. The substrate 4 has a window of the same shape as the window 3a at the position corresponding to the window 3a, and many laminated inner leads 5 are formed at the position between the inner leads formed at the substrate 3 at the periphery. |
