| 摘要 |
Disc- or plate-shaped targets for sputtering systems are attached to associated cooling plates by plasma-spraying a surface of such target with a compatible adhesive layer, for example composed of Ni; Ni/Cr mixtures; 80/20 Ni/Al mixtures; Ni/Al/Mo mixtures; Al/bronze mixtures; Mo; W; Al/Si mixtures, Zn, Cu, Cu/glass mixtures, etc., and then coating such adhesive layer with a solderable layer, for example composed of Cu, Cu/glass mixture or Ag, etc., and soldering such solderable layer onto the surface of a cooling plate. Preferably, the adhesive layer and the solderable layer are applied via plasma spraying.
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