发明名称 MANUFACTURE OF COMPOUND SEMICONDUCTOR DEVICE
摘要 PURPOSE:To secure the safety in a post-heat treatment by employing trimethyl arsine or triethyle arsine having weak toxicity as an As source when As ions are implanted in a compound semiconductor substrate. CONSTITUTION:When As ions are implanted in a semi-insulating GaAs substrate, (CH3)3As or (C2H5)3As is used as an As source. A carrier gas is Ar and H2. In this manner, no danger occurs like AsH3 when an ion implanted layer is heat treated to be activated, but safety can be secured. Simultaneously, heat treating device can be readily handled. Since mixture gas including Ar gas is used, uniform and good reproducible activation can be performed.
申请公布号 JPS57120330(A) 申请公布日期 1982.07.27
申请号 JP19810004986 申请日期 1981.01.19
申请人 TOKYO SHIBAURA DENKI KK 发明人 ISHIMURA HIROSHI;NAKANISHI TAKATOSHI
分类号 H01L21/265;H01L21/18;H01L21/324 主分类号 H01L21/265
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