发明名称 Active device substrate connector
摘要 The present invention relates to a connector of the type for electrically connecting an active device substrate unit for a PCB (printed circuit board). More particularly, the invention includes a dual-contact spring member having a buffer section so that forces exerted on one contact are not transmitted to the other contact.
申请公布号 US4341433(A) 申请公布日期 1982.07.27
申请号 US19800147766 申请日期 1980.05.08
申请人 AMP INCORPORATED 发明人 CHERIAN, GABRIEL B.;SCHEINGOLD, WILLIAM S.;YOUNGFLEISH, FRANK C.
分类号 H01R12/18;H05K7/10;(IPC1-7):H01R13/22 主分类号 H01R12/18
代理机构 代理人
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