发明名称 |
Active device substrate connector |
摘要 |
The present invention relates to a connector of the type for electrically connecting an active device substrate unit for a PCB (printed circuit board). More particularly, the invention includes a dual-contact spring member having a buffer section so that forces exerted on one contact are not transmitted to the other contact.
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申请公布号 |
US4341433(A) |
申请公布日期 |
1982.07.27 |
申请号 |
US19800147766 |
申请日期 |
1980.05.08 |
申请人 |
AMP INCORPORATED |
发明人 |
CHERIAN, GABRIEL B.;SCHEINGOLD, WILLIAM S.;YOUNGFLEISH, FRANK C. |
分类号 |
H01R12/18;H05K7/10;(IPC1-7):H01R13/22 |
主分类号 |
H01R12/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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