| 摘要 |
PURPOSE:To enable an automatic bonding by forming a hole for filling paste in an island of a ceramic package. CONSTITUTION:A hole for filling paste 6 is opened at the center of an island 5 of a ceramic package 1. Thus, the back surface of a semiconductor chip 3 is placed upside, is placed on a plate 7 having a flat surface, the package 1 is then placed on the back surface, and is placed so that the chip 3 is contained in the island 5. The surface of the chip 3 and the surface of the lead 2 are placed horizontally on the flat surface of the plate 7, the paste is filled from the end of the nozzle 8 to the hole opened at the island 5 of the package 1, and the mounting work is performed. In this manner, the surface of the lead 2 of the package 1 becomes the same plane with the surface of the chip 3, thereby enabling the detection of the position of both the surfaces to carry out the automatic bonding of a ceramic package IC. |
