发明名称 Mounting assembly for semiconductor devices and particularly power transistors
摘要 A mounting assembly for a semiconductor device, particularly a power transistor, which encloses and holds the device upon a plate which serves as a heat sink securely on a printed circuit board has a cover enclosing the device and a spacer. Holes in the spacer, a flange on the device, the plate, the cover and the printed circuit board receive one or more bolts which independently and securely clamp the flange and heat sink plate between the spacer and the board and also independently clamp the cover to the board.
申请公布号 US4342068(A) 申请公布日期 1982.07.27
申请号 US19800205366 申请日期 1980.11.10
申请人 TEKNATIONAL INDUSTRIES INC. 发明人 KLING, JARRETT B.
分类号 H01L23/40;(IPC1-7):H05K7/20 主分类号 H01L23/40
代理机构 代理人
主权项
地址