摘要 |
A mounting assembly for a semiconductor device, particularly a power transistor, which encloses and holds the device upon a plate which serves as a heat sink securely on a printed circuit board has a cover enclosing the device and a spacer. Holes in the spacer, a flange on the device, the plate, the cover and the printed circuit board receive one or more bolts which independently and securely clamp the flange and heat sink plate between the spacer and the board and also independently clamp the cover to the board.
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