| 摘要 |
<p>PURPOSE:To eliminate the expansion of solder more than required by providing a groove or a projection on the surface of a substrate for placing a semiconductor chip. CONSTITUTION:A recess 16 is formed on a metallic base or a ceramic substrate 11. When a chip 13 is placed on the substrate 11, an excess solder 12 except that to be bonded with the chip 13 is flowed and dropped on the surface of the substrate to the bottom of the groove of the recess 16. Thus, the flow of the solder 12 is stopped at the recess 16. Similarly, even if a projection is provided instead of the recess 16, similar effect can be obtained. In this manner, the utility rate of the ceramic container can be improved, thereby improving the workability of placing the chips.</p> |
