| 摘要 |
PURPOSE:To clearly adhere the marks such as letters, patterns and the like to the surface of a semiconductor device as well as to increase the adhesive strength by a method wherein, after the resin surface of a resin-sealed semiconductor device has been voil-treated with an organic solvent, the parting agent adhered to the resin surface is removed by burning with the flame of a hydrogen gas burner, and then a marking operation is performed on the resin surface of the semiconductor device. CONSTITUTION:The wax thin film, which is a parting agent, adhered to the resin surface of a resin-sealed lead frame is removed by the boiling steam 3 of a trichlene organic agent 2, then a plating work is performed on the frame 1, cleaned and dried up, A hydrogen gas burner 5 has an output flow meter, it emits a flame from a nozzle at an output of 0.5l/cm<3>, the flame is contacted to the surface of a resin-sealed semiconductor device 8 for 0.2-1.0 seconds. After the parting agent adhered to the resin surface has been removed by burning completely, letters, patterns and the like are printed on the resin surface using a printing transfer roller 6, and the ink of the printing is hardened by an ultraviolet ray lamp irradiation device.
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