| 摘要 |
PURPOSE:To improve the mounting efficiency for external connection pads and leads by a method wherein a plurality of first leads and a plurality of second leads are arranged in a multilayer shape through an insulation layer and a plurality of external connection pads are arranged in a plural row shape. CONSTITUTION:A plurality of first internal connection pads 2 are arranged in a periphery of IC1 and second internal connection pads 3 are arranged adjacent to the connection pads 2. On the other hands, a plurality of external connection pads consists of a plurality of external connection pads 4 formed in a single row closed to the periphery of a wiring substrate 11 and external connection pads 5 formed in a single row, closed to the IC1 and in parallel with the row of the pads 4. Are vertically arranged through an insulation layer 8 on the substrate 11, a plurality of a leads 6 for connecting the line between a plurality of the pads 2 and a plurality of corresponding pads 5 and a plurality of leads 7 for connecting the line between the pads 3 and the corresponding pads 4. Further, a terminal structure at the pad 4 and 5 side for the leads 6, 7 is formed in a coaxial shape. According to such a constitution, a mounting efficiency can be improved and also an additional wiring be established. |
