发明名称 SPUTTERING APPARATUS
摘要 PURPOSE:To form a thin film having a fixed composition and to facilitate lift- off by setting a slit member between a cathode and a substrate support for forming a film to prevent sticking to the uneven part of the substrate surface. CONSTITUTION:A negative voltage is applied to a cathode 8 holding a target material in a vacuum vessel 1, and a substrate support 9 for forming a film and a slit member 12 are grounded to cause glow discharge. By this sputtering a cathodic substance is emitted from the cathode 8, and while it is colliding with gaseous Ar molecules in the space between the cathode 8 and the member 12, only the cathodic substance parallel to the slits of the member 12 reaches the moving substrate support 9. Thus, a substance having the same composition as the cathodic substance is vapor-deposited on the substrate surface, sticking to the uneven part is reduced, and lift-off is enabled.
申请公布号 JPS57120669(A) 申请公布日期 1982.07.27
申请号 JP19810005700 申请日期 1981.01.16
申请人 MITSUBISHI DENKI KK 发明人 FUNADA ATSUSHI
分类号 C23C14/04;C23C14/34;C23C14/54;H01J37/34;H01L21/203 主分类号 C23C14/04
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