| 摘要 |
PURPOSE:To enable visual observation of the etching state of a plurality of semiconductor wafers arranged in an etching solution flowing paths and reduce the damage of the wafers by employing an etching apparatus having a plurality of oblique etching solution flowing paths on one side surface in a box. CONSTITUTION:There are provided an oblique surface plate on which a plurality of etching solution flowing paths are defined via projections 12 opposed on one side surface of a box 11, a plurality of wafer mounting plates 14 being longitudinally aligned in the respective flowing paths, and a plurality of projections 13 having lower height for holding the wafers as the lower ends of the plates 14. An etching solution efflux tank 16 for containing the etching solution is provided at the upper end of the box 11, and slits 15 for flowing the solution are formed at the tank in opposed manner with the respective flowing paths. Wafers 10 are arranged in the respective flowing paths thus constructed, and the etching solution is flowed from the tank 16. The solution thus flowed is accumulated through the solution reservoir 19 at the bottom of the box 11. At this time the upper and lower solutions are circulated through liquid feed tubes 17, 18 and 20, an intermediate tank 22, a constant-temperature oven 23, a liquid pump 21. etc. |
