| 摘要 |
PURPOSE:To prevent the turning up of the pattern on the circuit substrate and to improve its quality by a method wherein, after the surface of the pattern on the circuit substrate has been cut, a machine work is performed on the element mounting part. CONSTITUTION:The shorting pattern 32, to be used for plating, successively formed on the circuit substrate 1 and the pattern 31 to be used for bonding are thrust-in cut in the range of 45-75 deg. against the pattern surface using a chisel 11. Then, the element mounting part is machined and cut. Through these procedures, the turning up of the pattern due to the machine work is eliminated and the quality of the circuit substrate can be improved. |
