COOLER FOR INTEGRATED CIRCUIT

摘要

PURPOSE:To get rid of the movable part of a cooler for integrated circuits and to facilitate maintenance of the ICs by a method wherein the ICs are cooled through a head pipe adhered to the ICs. CONSTITUTION:The ICs 2 are fixed on a printed substrate 1. The first heat pipe part 3 is adhered with pressure to be fixed as to come in contact with the upper faces of all packages of the ICs 2 on the substrate 1. The joining part 31 to transmit heat of the heat pipe 3 to the second heat pipe part 7 is fixed to the upper part of the heat pipe 3. The tip end 72 of the second heat pipe 7 is extended outward from the front face of the substrate 1 to discharge heat transmitted from the heat pipe 3 to the outside of the substrate 1.