| 摘要 |
PURPOSE:To obtain a chip carrier provided with more leading out terminals than a traditional one in spite of its size similar to the traditional one by a method wherein the inner as well as the outer periphery of a frame equivalent to a substrate it is mounted upon in point of horizontal dimensions is provided with terminal pads. CONSTITUTION:A metal layer 12 for mounting an IC chip is provided at the central part on a surface of an exemplifiedly ceramic material made insulator substrate 11. Formed spreading around the outer periphery of the metal layer 12 on the substrate 11 are a first group of pads 13 for leading out terminals for connection with the IC chip, a bonding pad 14, a connecting pad 15, metal wirings 16 and 17. A frame 21 with its horizontal dimensions same as the substrate 11 is mounted on the substrate 11 to make a chip carrier. The frame 21 is usually provided only with a plurality of second pads 22 for leading out terminals but a third group of pads 23 for leading out terminals may be addedly provided on the inner periphery of the frame 21 without increasing horizontal dimensions. |
