| 摘要 |
PURPOSE:To effectively prevent the production of an improper shortcircuit even if a fine wire depends by providing an insulating member at a lead frame. CONSTITUTION:Before or after a semiconductor element 2 is mounted on a mounting pad 1, an insulating material made, for example, of resin is coated or sprayed on the peripheral edge of the pad 1 to form an insulating film 11. Thereafter, a fine wire 4 made of gold is used so-called by a wire bonding between the electrode of the element 2 and an inner lead 3. In this manner, even if the wire 4 depends, it contacts the film 11, but might not contact directly the pad 1, thereby effectively preventing the production of the improper shortcircuit. |
