| 摘要 |
PURPOSE:To prevent the creeping up of adhesive material on the side face of a pellet by a method wherein an adhesive material is added to the substrate to be used for the mounting of a semiconductor element, and the adhesive material is flattened by jetting gas from a diagonal direction. CONSTITUTION:After the adhesive material 11 has been added to the substrate 12 to be used for mounting of the semiconductor element of a lead frame and the like, the adhesive material is flattened by jetting nitrogen gas from a diagonal direction using an inclined nitrogen nozzle 13, and a semiconductor pellet is mounted on the adhesive material. Through these procedures, the creeping up of the adhesive material on the side face of the pellet and the inclination of the pellet itself can be prevented, thereby enabling to improve the yield rate of the subject semiconductor device. |
