发明名称 COOLING DEVICE FOR SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To improve the heat radiating effect of a cooling system by providing a cooling piece of the size of the degree equal to the area of an electrode of a semiconductor element, a guide plate larger than the cooling piece for surrounding the cooling piece and a cooling gas phase guide tube connected to the guide plate and opened on the surface of the coolant. CONSTITUTION:Vapor phase coolant 8a produced on the surface of a cooling piece A' provided in contact with the electrode of a semiconductor element is raised under the guidance of a vapor phase coolant guide tube 10. Thus the coolant reaches the top of a liquid reservoir 2, and enters a condenser 1. Thus, the cooled coolant is collected in the reservoir 2. On the other hand, liquid phase coolant 8b drops between a coolant flow conduit 11 and the tube 10 and returns to the bottom of the cooler A'. In this manner, even if the coolant vigorously boils, the smooth drop of the liquid coolant or the supply of the coolant to the cooler is not disturbed, but the semiconductor element can be stably cooled.
申请公布号 JPS57114260(A) 申请公布日期 1982.07.16
申请号 JP19810000309 申请日期 1981.01.07
申请人 TOYO DENKI SEIZO KK 发明人 YOSHIOKA KINJI
分类号 H01L23/427 主分类号 H01L23/427
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