发明名称 Hybrid circuit mfr. with screen printing - has insulating layer applied to magnetic core acting as carrier for final winding sections
摘要 <p>The hybrid circuit is formed using an insulating substrate onto which initial sections (F) of a conductor winding are applied via screen printing using a conductive paste. These sections (F) each have a contact zone (KF1,KF2) at either end and are partially covered by an insulating layer (Is1) to which a magnetic core (MK) is then attached via adhesive. The core (MK) is covered by a second insulating layer (Is2) simultaneously acting as a carrier for the remaining sections (A) of the winding, these sections (A) brought into contact with the initial sections (F) carried by the substrate (Su) via a final screen printing process. The circuit provides a variable inductance coil for use in a frequency filter.</p>
申请公布号 DE3046937(A1) 申请公布日期 1982.07.15
申请号 DE19803046937 申请日期 1980.12.12
申请人 SIEMENS AG 发明人 HALTENORTH,HELMUT,DR.RER.NAT.;PRUSSAS,HERBERT,DIPL.-ING.
分类号 H01F17/00;H01F27/00;H05K1/03;H05K1/09;H05K1/16;H05K1/18;H05K3/30;(IPC1-7):05K3/30 主分类号 H01F17/00
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