发明名称 PROCESS FOR MAKING PLANAR DIODES WITH LOW-COST SILICON SUBSTRATES AND SOLAR CELLS PRODUCED THEREFROM
摘要 {PG,1 Epitaxial and diffusion-type planar diodes and solar cells utilize low-cost refined metallurgical silicon substrates having a substantially higher impurity content than conventional high-cost, high purity semiconductor grade silicon. The epitaxial type products have an n-on-p-on-p substrate configuration, while the diffusion-type products have pentavalent impurities diffused therein to form a p-n junction in the low cost silicon substrate. One embodiment employs a multigrained refined metallurgical silicon (RMS) prepared by precipitating essentially iron-free silicon platelets from a solution of metallurgical grade silicon in molten aluminum, melting said refined platelets, in contact with a silica slag and pulling silicon boules from a melt of said refined metallurgical silicon (RMS). By directionally solidifying the refined silicon-slag melt, a multigrained, directionally solidified refined metallurgical silicon (DS/RMS) is obtained, with boules being pulled from a melt thereof for use as said low-cost substrate. The DS/RMS may also be re-melted and directionally solidified a second time with the boules being pulled from said twice directionally-solidified material being a desirable, low-cost, single crystal material suitable for use as said substrate for planar diode and solar cell applications.
申请公布号 DE2861867(D1) 申请公布日期 1982.07.15
申请号 DE19782861867 申请日期 1978.11.20
申请人 UNION CARBIDE CORPORATION 发明人 KOTVAL, PESHOTAN SOHRAB;STROCK, HAROLD BUNSEN
分类号 H01L31/04;C01B33/037;H01L31/18;(IPC1-7):01L31/18;01B33/02 主分类号 H01L31/04
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